壓力傳感器模塊由圓形或方形PCB板載,PCB板的2面分別安裝有壓力傳感器(MEMS硅壓阻或陶瓷)和信號處理電路芯片ASIC, ASIC對傳感器的偏移、靈敏度、溫漂和非線性進行數字補償,輸出經過放大、校驗、溫度補償后的電壓信號,該信號以供電電壓為參考,正比于壓力輸入,模塊用核心芯片自主設計,國外代工。Pressure Sensor Modules combine modern MEMS or Ceramic sensor technology with flexible signal processing of an ASIC.The module has a calibrated, analoge voltage output.
The XMP2xx Series Pressure Sensor IC combine modern MEMS sensor technology with flexible signal processing of an ASIC.The Pressure Sensor IC has a calibrated, analoge voltage output.XMP2F壓力傳感器在單一芯片內集成封裝了MEMS壓力傳感器和信號處理電路芯片ASIC,ASIC對傳感器的偏移、靈敏度、溫漂和非線性進行數字補償,輸出經過放大、校驗、溫度補償后的電壓信號,該信號以供電電壓為參考,正比于壓力輸入。器件具有一致性好和重復性高等優點。